[1] Leon C A, Drew R A L. Preparation of nickel-coated powders Al2O3 and SiC as precursors to reinforce MMCs[J]. J Mater Sci, 2000, 35:4763-4768.
[2] Lin L, Xue Q J, Zhao J Z. Microstructure and tribological behaviour of electroless Ni-P plating reinforced by fine TiN powders[J]. Tribology, 1995, 15(2): 104-104.
[3] Chang S Y, Lin J H, Lin S J, et al. Processing copper and silver matrix composites by electroless plating and hot pressing[J]. Metallur & Mater Trans A, 1999, 30(4): 1119-1136.
[4] Joshi P B, Murti N S S, Gadgeel V L, et al. Preparation and characterization of Ag-ZnO powders for applications in electrical contact materials[J]. J Mater Sci Lett, 1995, 14:1099-1101.
[5] Harizanov O A, Stefchev P L, Iossifova A. Metal coated alumina powder for metalloceramics [J]. Mater Lett, 1998, 33(5-6):297-299.
[6] Wen G W, Guo Z X, Davies C. Electroless plating for the enhancement of material performance[J]. Mater Tech, 1999, 14:210-217.
[7] Wang C Y, Zhou Y, Zhu Y R, et al. Synthesis and characterization of NiP-TiO2 ultrafine composite particles[J]. Mater Sci & Eng, 2000, B77(1):135-137.
[8] Li Y D, Li C W, Wang H R, et al. Preparation of nickel ultrafine powder and crystalline film by chemical control reduction[J]. Mater Chem & Phys, 1999, 59:88-90.