[1] Lan S, Tan C M, Wu K. Reliability study of LED driver—A case study of black box testing [J]. Microelectronics Reliability, 2012, 52(9/10):1940-1944. DOI:10.1016/j.microrel.2012.06.023.
[2] Fan J J, Yung K C, Pecht M. Lifetime estimation of high-power white led using degradation-data-driven method [J]. IEEE Transactions on Device and Materials Reliability, 2012, 12(2):470-477. DOI:10.1109/tdmr.2012.2190415.
[3] Wang F K, Lu Y C. Useful lifetime analysis for high-power white LEDs [J]. Microelectronics Reliability, 2014, 54(6/7):1307-1315. DOI:10.1016/j.microrel.2014.02.029.
[4] Tarashioon S, Baiano A, van Zeijl H, et al. An approach to “Design for Reliability” in solid state lighting systems at high temperatures [J]. Microelectronics Reliability, 2012, 52(5): 783-793. DOI:10.1016/j.microrel.2011.06.029.
[5] Illuminating Engineering Society. LM-79-08 Electrical and photometric measurements of solid state lighting products[S]. USA: Illuminating Engineering Society, 2008.
[6] Illuminating Engineering Society. LM-84-14 Approved method: Measuring luminous flux and color maintenance of LED lamps, light engines, and luminaires [S]. USA: Illuminating Engineering Society, 2014.
[7] Illuminating Engineering Society. TM-28-14 Projecting long-term luminous flux maintenance of LED lamps and luminaires [S]. USA: Illuminating Engineering Society, 2014.
[8] Illuminating Engineering Society. LM-80-08 Approved method: Measuring lumen maintenance of LED light sources[S]. USA: Illuminating Engineering Society, 2008.
[9] Illuminating Engineering Society. TM-21-11 Projecting long term lumen maintenance of LED light sources[S]. USA: Illuminating Engineering Society, 2008.
[10] Koh S, Yuan C, Sun B, et al. Product level accelerated lifetime test for indoor LED luminaires[C]//14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems(EuroSimE). 2013:6529995-1-6529995-6. DOI: 10.1109/EuroSimE.2013.6529995.
[11] Yan J, Shang Z D, Chen J X. Investigation on the aging characteristics of high-power white LEDs under different stresses[C]//Asia Communications and Photonics Conference and Exhibition. Shanghai, China, 2009: 76360B-1-76350B-6. DOI:10.1364/acp.2009.wh5.
[12] Nogueira E, Vazquez M, Mateos J. Accelerated life test of high luminosity AlGalnP LEDs [J]. Microelectronics Reliability, 2012, 52(9/10):1853-1858. DOI.10.1016/j.microrel.2012.06.125.
[13] Tan C M, Singh P. Time evolution degradation physics in high power white LEDs under high temperature-humidity conditions [J]. IEEE Transactions on Device and Materials Reliability, 2014, 14(2): 742-750. DOI: 10.1109/TDMR.2014.2318725.
[14] Cai M, Yang D G, Tian K M, et al. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method [J]. Microelectronics Reliability, 2015, 55(9):1784-1789. DOI:10.1016/j.microrel.2015.06.147.
[15] Tang H Y, Yang D G, Zhang G Q, et al. Multi-physics simulation and reliability analysis for LED luminaires under step stress accelerated degradation test[C]//13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems(EuroSimE). 2012: 6191774-1-6191774-5. DOI: 10.1109/ESimE.2012.6191774.
[16] Ren R B, Yang D G, Cai M, et al. Reliability assessment of LED luminaires based on step-stress accelerated degradation test[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging(ICEPT-HDP). Guilin, China, 2012:1495-1499.
[17] Zhang J P, Zhou T J, Wu H, et al. Constant-step-stress accelerated life test of white OLED under Weibull distribution case [J]. IEEE Transactions on Electron Devices, 2012, 59(3): 715-720. DOI: 10.1109/TED.2011.2181175.
[18] Zhang L F, Xie M, Tang L C. Bias correction for the least squares estimator of Weibull shape parameter with complete and censored data [J]. Reliability Engineering & System Safety, 2006, 91(8): 930-939. DOI:10.1016/j.ress.2005.09.010.
[19] Han M, Ding Y Y. Synthesized expected Bayesian method of parametric estimate [J]. Journal of Systems Science and Systems Engineering, 2004, 13(1):98-111. DOI:10.1007/s11518-006-0156-0.
[20] Gu Y, Narendran N. A non-contact method for determining junction temperature of phosphor-converted white LEDs [C]//Third International Conference on Solid State Lighting. San Diego, CA, USA, 2004: 107-114. DOI:10.1117/12.509751.