[1] Wang Yong, Wei Wei, Yang Dong, et al. 3D heterogeneous integration of wideband RF chipsusing silicon-based adapter board technology [J]. Journal of Southeast University (English Edition), 2021, 37 (1): 8-13. [doi:10.3969/j.issn.1003-7985.2021.01.002]

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3D heterogeneous integration of wideband RF chipsusing silicon-based adapter board technology()

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Journal of Southeast University (English Edition)[ISSN:1003-7985/CN:32-1325/N]

Volumn:

37

Issue:

2021 1

Page:

8-13

Research Field:

Electronic Science and Engineering

Publishing date:

2021-03-20

Info

Title:

3D heterogeneous integration of wideband RF chipsusing silicon-based adapter board technology

Author(s):

Wang Yong¹;  2;  Wei Wei²;  Yang Dong³;  Sun Biao²Zhang Xingwen²;  Zhang Youming⁴;  5;  Huang Fengyi⁴;  5

¹School of Information Science and Engineering, Southeast University, Nanjing 210096, China
²Yangzhou Marine Electronic Instrument Institute, Yangzhou 225001, China
³Hebei Semiconductor Research Institute, Shijiazhuang 050002, China
⁴School of Cyber Science and Engineering, Southeast University, Nanjing 210096, China
⁵ Purple Mountain Laboratories, Nanjing 211111, China

Keywords:

silicon-based adapter board;  frequency mixing;  frequency multiplier;  multi-function chip

PACS:

TN389

DOI:

10.3969/j.issn.1003-7985.2021.01.002

Abstract:

An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology. Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process. Each layer adopts though silicon via(TSV)technology to realize signal interconnection. A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity, and the silicon-based filter is integrated with the high-resistance silicon substrate. The interconnect line, cavity and filter of the silicon-based adapter board are designed with AutoCAD, and HFSS is adopted for 3D electromagnetic field simulation. According to the measured results, the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm. The multiplier multi-function chip operates at 16-20 GHz. The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm×8 mm×1 mm. The cascaded fully assembled mixing component achieves a spur of better than -50 dBc and a gain of better than 15 dB.

References:

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Memo

Memo:

Biographies: Wang Yong(1983—), male, Ph.D. candidate; Zhang Youming(corresponding author), male, doctor, associate research fellow, zhangyouming@seu.edu.cn.
Citation: Wang Yong, Wei Wei, Yang Dong, et al. 3D heterogeneous integration of wideband RF chips using silicon-based adapter board technology[J].Journal of Southeast University(English Edition), 2021, 37(1):8-13.DOI:10.3969/j.issn.1003-7985.2021.01.002.

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