|Table of Contents|

[1] Wang Yong, Wei Wei, Yang Dong, et al. 3D heterogeneous integration of wideband RF chipsusing silicon-based adapter board technology [J]. Journal of Southeast University (English Edition), 2021, (1): 8-13. [doi:10.3969/j.issn.1003-7985.2021.01.002]
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3D heterogeneous integration of wideband RF chipsusing silicon-based adapter board technology()
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Journal of Southeast University (English Edition)[ISSN:1003-7985/CN:32-1325/N]

Volumn:
Issue:
2021年第1期
Page:
8-13
Research Field:
Electronic Science and Engineering
Publishing date:
2021-03-20

Info

Title:
3D heterogeneous integration of wideband RF chipsusing silicon-based adapter board technology
Author(s):
Wang Yong1 2 Wei Wei2 Yang Dong3 Sun Biao2Zhang Xingwen2 Zhang Youming4 5 Huang Fengyi4 5
1School of Information Science and Engineering, Southeast University, Nanjing 210096, China
2Yangzhou Marine Electronic Instrument Institute, Yangzhou 225001, China
3Hebei Semiconductor Research Institute, Shijiazhuang 050002, China
4School of Cyber Science and Engineering, Southeast University, Nanjing 210096, China
5 Purple Mountain Laboratories, Nanjing 211111, China
Keywords:
silicon-based adapter board frequency mixing frequency multiplier multi-function chip
PACS:
TN389
DOI:
10.3969/j.issn.1003-7985.2021.01.002
Abstract:
An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology. Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process. Each layer adopts though silicon via(TSV)technology to realize signal interconnection. A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity, and the silicon-based filter is integrated with the high-resistance silicon substrate. The interconnect line, cavity and filter of the silicon-based adapter board are designed with AutoCAD, and HFSS is adopted for 3D electromagnetic field simulation. According to the measured results, the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm. The multiplier multi-function chip operates at 16-20 GHz. The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm×8 mm×1 mm. The cascaded fully assembled mixing component achieves a spur of better than -50 dBc and a gain of better than 15 dB.

References:

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Memo

Memo:
Biographies: Wang Yong(1983—), male, Ph.D. candidate; Zhang Youming(corresponding author), male, doctor, associate research fellow, zhangyouming@seu.edu.cn.
Citation: Wang Yong, Wei Wei, Yang Dong, et al. 3D heterogeneous integration of wideband RF chips using silicon-based adapter board technology[J].Journal of Southeast University(English Edition), 2021, 37(1):8-13.DOI:10.3969/j.issn.1003-7985.2021.01.002.
Last Update: 2021-03-20