|Table of Contents|

[1] Ni Tianming, Liang Huaguo, Nie Mu, et al. An optimal stacking order for mid-bond testing cost reductionof 3D IC [J]. Journal of Southeast University (English Edition), 2018, 34 (2): 166-172. [doi:10.3969/j.issn.1003-7985.2018.02.004]

An optimal stacking order for mid-bond testing cost reductionof 3D IC()

Journal of Southeast University (English Edition)[ISSN:1003-7985/CN:32-1325/N]

2018 2
Research Field:
Computer Science and Engineering
Publishing date:


An optimal stacking order for mid-bond testing cost reductionof 3D IC
Ni Tianming1 2 Liang Huaguo1 Nie Mu3 Bian Jingchang1 Huang Zhengfeng1 Xu Xiumin1 Fang Xiangsheng3
1 School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei 230009, China
2Department of Electronic Information and Electrical Engineering, Hefei University, Hefei 230601, China
3School of Computer and Information, Hefei University of Technology, Hefei 230009, China
three-dimensional integrated circuit(3D IC) mid-bond test cost stacking order sequential stacking failed bonding
In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high, an optimal stacking order scheme is proposed to reduce the mid-bond test cost. A new testing model is built with the general consideration of both the test time for automatic test equipment(ATE)and manufacturing failure factors. An algorithm for testing cost and testing order optimization is proposed, and the minimum testing cost and optimized stacking order can be carried out by taking testing bandwidth and testing power as constraints. To prove the influence of the optimal stacking order on testing costs, two baselines stacked in sequential either in pyramid type or in inverted pyramid type are compared. Based on the benchmarks from ITC’02, experimental results show that for a 5-layer 3D IC, under different constraints, the optimal stacking order can reduce the test costs on average by 13% and 62%, respectively, compared to the pyramid type and inverted pyramid type. Furthermore, with the increase of the stack size, the test costs of the optimized stack order can be decreased.


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Biographies: Ni Tianming( 1991— ), male, Ph.D. candidate; Liang Huaguo(corresponding author), male, professor, huagulg@hfut.edu.cn.
Foundation items: The National Natural Science Foundation of China( No.61674048, 61574052, 61474036, 61371025), the Project of Anhui Institute of Economics and Management(No.YJKT1417T01).
Citation: Ni Tianming, Liang Huaguo, Nie Mu, et al.An optimal stacking order for mid-bond testing cost reduction of 3D IC[J].Journal of Southeast University(English Edition), 2018, 34(2):166-172.DOI:10.3969/j.issn.1003-7985.2018.02.004.
Last Update: 2018-06-20